Wettability of Sn-Cu-Ni-xEu lead free solder based on Taguchi method
1. School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou, Jiangsu 221116, China| 2. Department of Materials Science and Engineering, University of California at Los Angeles, Los Angeles, CA 90095, USA
Abstract：The wettability of Sn-Cu-Ni-xEu leadfree solders on different substrates with different fluxes and atmospheres were investigated based on Taguchi method, and the effects of control factors on the wettability of leadfree solders were analyzed. The results show that the effects of control factors of solder material, flux, substrate material and atmosphere on the wettability of leadfree solder joints are obviously different. The contribution decreasing sequence of the four factors is factor B(flux), factor D (atmosphere), factor A (solder material), factor C (substrate). The flux is the most important factor among the control factors on the wettability. The optimal design conditions of wettability in the leadfree solders system are Sn-Cu-Ni-0.04Eu solder and RMA flux with Au/Ni/Cu substrate at vacuum atmosphere. The addition of rare earth of Eu can significantly improve the wettability of solders.
2015, Vol. 36 
