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Numerical simulation on thermal fatigue stress field of
directionally solidified Al-Cu alloy |
1.School of Material Science and Engineering, Jiangsu University, Zhenjiang, Jiangsu 212013, China; 2.Zhenjiang Yinuowei Memory Alloy Cooperation Limited, Zhenjiang, Jiangsu 212009, China) |
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Abstract The thermal fatigue stress field of directionally solidified Al-Cu alloy with Cu mass fraction of 4.5%) was investigated with commercial finite element method(FEM) software ANSYS. Changing rules of thermal stress field were obtained under thermal cycling condition. In one thermal cycle,thermal stress expands into the sample by the form of small triangle,and with later quick extending by the form of master stroke. The change of thermal stress becomes slow finally. After one cycle, there is residual stress in the sample. With the increasing of cycle extent, residual stress cumulates gradually. Thermal fatigue cracks appear when residual stress reaches a certain extent. Furthermore, simulating results were compared with experimental results of thermal fatigue crack initiation and propagation in alloy samples. The results validate the reliability of the adopted FEM.
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