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| Lifetime prediction and failure analysis of IGBT module based on accelerated lifetime test |
| National Key Laboratory of Vessel Integrated Power System Technology, Naval University of Engineering, Wuhan, Hubei 430033, China |
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Abstract To realize reliability analysis and lifetime prediction of IGBT, a new method for the lifetime prediction of IGBT module was proposed based on accelerated lifetime test. The theory and the method of fast power cycling test were dissertated. The lognormal distribution was adopted to describe the lifetime of IGBT. Based on Arrhenius module, the statistic and the analysis on testing data were achieved by maximum likelihood estimation method to establish lifetime prediction model of IGBT . The accurate estimation of IGBT lifetime was realized, and the failure mechanism of IGBT was analyzed in detail. The results show that the IGBT lifetime is followed by lognormal distribution, not by Weibull distribution. With the increasing of junction temperature range, the lifetime of IGBT is decreased, and the mode is thermal failure at the end of IGBT lifetime.
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Received: 07 June 2012
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2013, Vol. 34 
